SmartX completed Round B+ and Round C financing of 200 million yuan

Continuing to lead the post-market of automotives, Casstime received Round C2 Financing of 50 million USDs

Yunzhanghu donated fund and materials to help win the fight against COVID-19

Leshanvc cooperated with Huawei to build the first heterogeneous platform supporting Ascend 910

EPiCMEMS launched its "Hummingbird" brand and the first highly integrated 4G/5G receiver module chip in China

Silicon Integrated launched the first independently developed back-illuminated HD ToF sensor chip in China

Galaxycore officially signed contract for its 2.2 billion USD project, and Shanghai Lingang witnessed another 10 billion projects!

ICHUNT: Pleasing development with JD in IC sector

Casstime completed Round C1 financing of 80 million USDs, Jiang Yongxing: expanding boundaries from 1 to N